| Item
|
ST#103
|
ST#106
|
LF-51
|
LF-332
|
Testing
Method |
| Flux
Type
|
F-SW32
|
RMA
|
RMA
|
RMA
|
-
|
| Flux
Content, wt % |
1.0-3.5
|
1.0-3.5
|
1.0-3.5
|
1.0-3.5
|
JIS
Z 3197 |
| Halide
content, wt% |
Halide
Free |
0.06
|
<
0.10 |
<
0.20 |
JIS
Z 3197 |
| Spread
Factor, % |
More
than 90 |
More
than 90 |
More
than 75 |
More
than 78 |
JIS
Z 3197 |
| Copper
mirror |
Pass
|
Pass
|
Pass
|
High
|
IPC-TM-650
|
| Corrosion,
flux |
Pass
|
Pass
|
Pass
|
High
|
IPC-TM-650
|
| Silver
chromate |
Pass
|
Pass
|
Pass |
Pass
|
IPC-TM-650 |
| SIR,
OHM |
1
x 10*8 min |
1
x 10*8 min |
1
x 10*8 min |
1
x 10*8 min |
IPC-TM-650(@
85 O C/85% RH) |
| Application
|
Clear
residue no-clean halide free flux used by assemblies' manufacturer
utilizing low solid no-clean wave soldering fluxes |
RMA:
developed for used by assemblies manufacturer utilizing low solid
no clean wave-soldering fluxes |
RMA
|
No-Clean
Core-flux: minimal spitting, fast and excellent instant wetting action,
ideally used mainly by SMT no-clean solder-paste / Low solids no-
clean fluxes assemblies processes manufacturer |
- |
| Item
|
ST#113W
|
ST#108
|
Testing
Method |
| Flux
Type
|
Water
Soluble |
Water
Soluble |
- |
| Flux
Content, wt %
|
1.0-3.5
|
1.0-3.5
|
JIS
Z 3197 |
| Halide
content, wt%
|
2.2
|
2.0
max |
JIS
Z 3197 |
| Spread
Factor, %
|
More
than 90 |
More
than 90 |
JIS
Z 3197 |
| Copper
mirror
|
High
|
High
|
IPC-TM-650
|
| Corrosion,
flux
|
High
|
High
|
IPC-TM-650
|
| Silver
chromate
|
Fail
|
Fail
|
IPC-TM-650
|
| SIR,
OHM (Washed Board) |
1
x10*8 min |
1
x10*8 min |
IPC-TM-650
(@ 85 O C/85% RH) |
| Application
|
Aqua-soluble
core flux for used by assembly's manufacturer utilizing water washing
cleaning process. This flux is a high activity, heat stable with minimal
fumes and odor. The residues left are near neutral pH and the core-flux
can be utilized with an open torch flame or a soldering iron. 113W
will solder copper, brass and nickel materials. Post flux residues
can be washed with lukewarm water (50-60 O C) |
Aqua-soluble
core flux was developed for used by assemblies' manufacturer utilizing
water-soluble wave soldering fluxes and aqua-soluble solder paste
SME process The flux is thermally heat stable with minimal fumes and
odor. The residua can be completely removed with luke-warm simple
water rinse. Solder fillets can left up to 24 hours and still remains
shiny prior sending for post washing with water. |
-
|
| Item
|
LF-66
|
L339-2
|
ST#109
|
UA-66
|
Testing
Method |
| Flux
Type |
RA
|
RA
|
RA
|
RA
|
-
|
| Flux
Content, wt % |
2.0-3.3
|
2.0-3.3
|
2.0-3.3
|
1.0-3.0
|
JIS
Z 3197 |
| Halide
content, wt% |
Over
0.5 up to and incl. 1.0 |
<
0.45 |
<
0.45 |
Over
0.1 up to and incl. 0.5 |
JIS
Z 3197 |
| Spread
Factor, % |
More
than 80 |
More
than 78 |
More
than 90 |
More
than 80 |
JIS
Z 3197 |
| Copper
mirror |
Pass
|
Pass
|
Pass
|
Pass
|
IPC-TM-650
|
| Corrosion,
flux |
Pass
|
Pass
|
Pass
|
Pass
|
IPC-TM-650
|
| SIR,
OHM |
1
x 10 *8 min |
1
x 10 *8 min |
1
x 10 *8 min |
1
x 10 *8 min |
IPC-TM-650
(@ 85 O C/85% RH) |
| Application
|
Brass
and copper Brass and copper for consumer product |
Clear
residue core flux for lead-free alloy cored solder wire was developed
for minimal spitting, fast and excellent instant wetting action, ideally
suitable for critical products assemblies manufacturer requiring |
Fast
and excellent instant wetting action used mainly by consumer products
assemblies manufacturer |
Brass
and copper for consumer product |
- |
| Item
|
MA337
|
MA338
|
CF-203
|
CF-208
|
Testing
Method |
| Flux
Type |
RA
|
RA
|
ORM1
|
ORL0
|
-
|
| Flux
Content, wt % |
1-4.5 |
1.3-3.3 |
1.5-3.3 |
1.5-3.3 |
JIS
Z 3197 |
| Halide
content, wt% |
1.33
|
<
1.0 |
0.75
+ 0.05 |
0
|
JIS
Z 3197 |
| Spread
Factor, % |
More
than 90 (Sn-37Pb) |
More
than 90 (Sn-37Pb) |
More
than 90 (Sn-37Pb) |
More
than 90 (Sn-37Pb) |
JIS
Z 3197 |
| Copper
mirror |
Moderate(M)
|
Moderate(M)
|
Pass
|
Pass
|
IPC-TM-650
|
| Corrosion,
flux |
Moderate(M)
|
Moderate(M)
|
Pass
|
Pass
|
IPC-TM-650
|
| SIR,
OHM |
1
x 10 *8 min |
1
x 10 *8 min |
1
x 10 *8 min |
1
x 10 *8 min |
IPC-TM-650
(@ 85 O C/85% RH) |
| Application
|
Ideally used mainly by consumer products assemblies'. Able to wet/solder oxidized Copper, Nickel and Zinc alloy substrate surfaces |
Ideally
used mainly by consumer products assemblies'. Able to wet/solder oxidized
Copper, Nickel and Zinc alloy substrate surfaces |
Rosin-Free,
clear-residua no-clean flux for cored solder wire developed for used
by assemblies' manufacturer utilizing No-Rosin, low solid no clean
wave-soldering fluxes and eliminate ASTHMA AND SENSITIZERS is issues
commonly found in Rosin-based fluxes. |
Rosin-Free,
Halide Free clear-residua no-clean flux for cored solder wire developed
for used by assemblies' manufacturer utilizing No-Rosin, low solid
no clean wave-soldering fluxes and eliminate ASTHMA AND SENSITIZERS
is issues commonly found in Rosin-based fluxes. |
- |